Odisha Secures Landmark Semiconductor Investment with Intel & 3DGS

Bhubaneswar: In a transformative step for India’s technology landscape, Intel Corporation and 3D Glass Solutions (3DGS) have signed a Memorandum of Understanding (MoU) with the Government of Odisha to establish a state‑of‑the‑art semiconductor glass core packaging facility.

The project, among the largest technology investments in Eastern India, positions Odisha as a hub for advanced semiconductor manufacturing, AI infrastructure, and next‑generation data centres.

Leveraging 3DGS’s glass‑core substrate technology and Intel Foundry’s expertise, the facility will accelerate packaging solutions critical for artificial intelligence, high‑performance computing, and electronics.

Welcoming the initiative, 3DGS CEO Babu Mandava highlighted India’s potential as a global hub for advanced substrates, while Intel EVP Naga Chandrasekaran emphasised the collaboration’s role in commercialising next‑gen packaging worldwide.

Odisha Chief Secretary Anu Garg described the project as a “transformative step” for the state’s semiconductor ambitions.

State Minister Mukesh Mahaling stressed its impact on job creation and inclusive growth, while Union Minister Ashwini Vaishnaw linked the investment to India’s domestic manufacturing goals under Atmanirbhar Bharat.

Odisha Chief Minister underscored the generational opportunity to boost economic growth and technological self‑reliance.

The initiative aligns with Odisha Vision 2036 and India’s national agenda to build a robust ecosystem of innovation, talent, and infrastructure.

The state has extended an open invitation to global technology companies, research institutions, and ecosystem partners to join this ambitious journey.